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Electronic Encapsulation & Adhesives

Electronic Encapsulation & Adhesives Solutions

 
High-performance epoxy and PU systems for potting, sealing, and bonding critical electronic components.

Common Frustrations?

Challenges in Electronic Encapsulation

Protecting delicate components from moisture, heat, and vibration requires precision materials and process control.

Moisture & Thermal Damage
Moisture & Thermal Damage

Moisture & Thermal Damage

Moisture and temperature changes can cause electronic components to degrade in performance or short-circuit.

Poor Adhesion & Cracking
Poor Adhesion & Cracking

Poor Adhesion & Cracking

The material cracked after curing, causing the protective layer to fail.

Complex Process Control
Complex Process Control

Complex Process Control

Precise control is required for different components, proportions, and curing temperatures.

Our Reliable Solutions

Integrated Encapsulation & Adhesive Systems

Moisture & Thermal Protection

This system provides comprehensive moisture and thermal protection, specifically designed for electronic circuits operating in harsh environments. Its high insulation and moisture resistance properties effectively prevent moisture ingress and electrical failure, while maintaining stable performance at temperatures up to 150°C, ensuring long-term reliability and service life of equipment under demanding conditions.

  • Long-term insulation reliability.
  • High moisture resistance.
  • Excellent heat resistance.
  • Chemical Corrosion Resistance.
  • Low Outgassing & Cleanroom Compatibility.
  • UV & Ozone Stability.
Moisture & Thermal Protection

High Adhesion & Crack Resistance

This flexible system is specifically engineered to address stress cracking caused by thermal expansion/contraction and mechanical vibration. It exhibits excellent adhesion to various substrates including metals and plastics. Its unique elastomeric properties allow it to absorb and dissipate stress, effectively inhibiting the initiation and propagation of cracks, providing durable and stable protection for precision components.

  • Strong adhesion to metals & plastics.
  • Elastic flexibility.
  • Stress absorption.
  • Fatigue Resistance & Durability.
  • Shock & Vibration Dampening.
High Adhesion & Crack Resistance

Efficient Mixing & Curing

Formulated with low viscosity and fast-curing properties for automated production lines. Its excellent fluidity and adjustable pot life ensure precise filling and uniform curing during high-speed dispensing and potting processes, resulting in a smooth, dense, and bubble-free perfect finish that significantly enhances the efficiency and consistency of mass production.

  • Easy automation.
  • Adjustable pot life.
  • Smooth surface finish.
  • Selective Curing Control.
  • Zero-Void Filling Capability.
Efficient Mixing & Curing

Why Choose Our Encapsulation Systems

Engineered for Reliable Electronic Protection

Precision Formulation
01
Precision Formulation

Precision Formulation

Adaptable to different electronic modules and process requirements.

Consistent Curing
02
Consistent Curing

Consistent Curing

Ensuring zero bubbles and stress-free operation.

Reliability Testing
03
Reliability Testing

Reliability Testing

Passing temperature and humidity cycling, insulation, and aging tests.

Proven Success in Electronics Protection

Power Module Potting (United Kingdom)
Power Module Potting (United Kingdom)
Power Module Potting (United Kingdom)

Our client, a UK-based industrial power supply manufacturer, faced challenges with their next-generation high-power modules, which suffered from inefficient heat dissipation and moisture ingress risks during high-temperature operation, leading to potential premature failures and reliability concerns.

By adopting our Epoxy 1169AB Potting Resin, with its superior thermal conductivity and robust sealing protection, the module's heat dissipation efficiency was improved by over 15%, while moisture was effectively blocked. This ensured long-term, stable performance of the power units in harsh industrial environments, significantly extending product lifespan.

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Sensor Sealing (France)
Sensor Sealing (France)
Sensor Sealing (France)

A global top-tier automotive component supplier in France required a potting material for their new generation of smart sensors that could maintain flexibility and a reliable seal under extreme temperature fluctuations.

Our PU-918AB-18 Potting Compound, with its excellent high and low-temperature resistance (-40°C to 125°C) and permanent elasticity, provided perfect waterproof and shockproof protection for the sensors. This solution successfully passed rigorous automotive-grade endurance tests, ensuring signal accuracy and functional safety throughout the vehicle's entire lifecycle.

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PCB Adhesion & Protection (United States)
PCB Adhesion & Protection (United States)
PCB Adhesion & Protection (United States)

A US-based high-end industrial equipment manufacturer faced issues with control panel assemblies loosening and connector failures due to strong vibrations during transport and operation, leading to high post-sale failure rates.

The application of our 312AB-6-N High-Strength Structural Adhesive, with its exceptional bond strength and impact resistance, securely locked precision components in place and effectively absorbed mechanical stress. This improvement reduced vibration-related failures in the control board assemblies by over 90%, significantly enhancing the end product's durability and market reputation.

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Helpful Technical Resources

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Contact our team for customized resin and adhesive solutions tailored to your production needs.

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Already served 300+ electronic manufacturing enterprises, products passed industry authoritative certifications.

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